Method of manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12216399
APP PUB NO 20240192588A1
SERIAL NO

18582045

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Importance

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Abstract

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A reticle enclosure includes a base including a first surface, a cover including a second surface and coupled to the base with the first surface facing the second surface. The base and the cover form an internal space that includes a reticle. The reticle enclosure includes restraining mechanisms arranged in the internal space and for securing the reticle, and structures disposed adjacent the reticle in the internal space. The structures enclose the reticle at least partially, and limit passage of contaminants between the internal space and an external environment of the reticle enclosure. The structures include barriers disposed on the first and second surfaces. In other examples, a padding is installed in gaps between the barriers and the first and second surfaces. In other examples, the structures include wall structures disposed on the first and second surfaces and between the restraining mechanisms.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Hao-Shiang Hsinchu, TW 4 0
Chien, Tsung-Chih Caotun Township, TW 16 17
Lee, Tsung Chuan Taipei, TW 13 10
Shih, Chih-Tsung Hsinchu, TW 146 2276

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