Chip test pressing-down apparatus and formation method thereof

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12216156
APP PUB NO 20240410935A1
SERIAL NO

18432968

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present disclosure includes a die test pressing-down apparatus and a formation method. The die test pressing-down apparatus includes a support frame capable of moving along a vertical direction; and a pressing-down block installed on the support frame. A part to-be-pressed is disposed directly below the pressing-down block. The pressing-down block is connected to the support frame through an installation plate; a strip-shaped through hole is formed at an upper surface of the support frame; a first protruding strip is at each lower portion of two opposite inner walls of the strip-shaped through hole; a corresponding second protruding strip is at each upper portion of two opposite side surfaces of the installation plate; and a side of a strip-shaped block is fixedly connected to the upper surface of the support frame, and another side of the strip-shaped block is connected to the second protruding strip through at least two springs.

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Patent Owner(s)

  • SEMIGHT INSTRUMENTS CO., LTD

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Haiyang Suzhou, CN 19 16
Huang, Jianjun Suzhou, CN 30 53
Lian, Zhe Suzhou, CN 10 0
Wu, Yonghong Suzhou, CN 10 34
Zhao, Shan Suzhou, CN 11 0

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