Shutter disc for a semiconductor processing tool

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United States of America

PATENT NO 12215414
APP PUB NO 20230383397A1
SERIAL NO

18447543

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Abstract

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Some implementations described herein provide a shutter disc for use during a conditioning process within a processing chamber of a deposition tool. The shutter disc described herein includes a material having a wave-shaped section to reduce heat transfer to the shutter disc and to provide relief from thermal stresses. Furthermore, the shutter disc includes a deposition of a thin-film material on a backside of the shutter disc, where a diameter of the shutter disc causes a spacing between an inner edge of the thin-film material and an outer edge of a substrate support component. The spacing prevents an accumulation of material between the thin film material and the substrate support component, reduces tilting of the shutter disc due to a placement error, and reduces heat transfer to the shutter disc.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN ROAD 6 HSINCHU SCIENCE PARK HSINCHU 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Yi-Chao Hsinchu, TW 4 1
Chiu, Hua-Sheng Zhudong Town, TW 5 2
Lee, Chin-Szu Taoyuan, TW 61 106
Mue, Zih-Shou Hsinchu, TW 2 1
Wang, Yi-Lin Kaohsiung, TW 7 20

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