Microneedle arrays with undercut features for cutaneous and non-cutaneous drug delivery

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12214150
APP PUB NO 20220241570A1
SERIAL NO

17611486

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Abstract

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The disclosed methods relate to forming microneedle arrays from a production mold that comprises a flexible mold material. The disclosed methods can be used to reproducibly manufacture undercut dissolvable and coated microneedle arrays with various shapes and structures.

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Patent Owner(s)

Patent OwnerAddress
UNIVERSITY OF PITTSBURGH - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION130 THACKERAY AVE 1ST FLOOR GARDNER STEEL CONFERENCE CENTER PITTSBURGH PA 15260

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Falo,, Jr Louis D Wexford, US 24 267
Korkmaz, Emrullah Pittsburgh, US 4 1

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