Message split-aggregation for multi-stage electrical interconnection network

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United States of America

PATENT NO 12212498
APP PUB NO 20230254253A1
SERIAL NO

18101732

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Abstract

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Message splitting and aggregation in a multi-stage electrical interconnection network are disclosed. A method of operating an electronic device comprised of computing devices, includes splitting, into segments, a message to be transmitted from a first of the computing devices, transmitting the segments to a second of the computing devices through a multi-channel that is based on an electrical connection between the first computing device and a plurality of switches, wherein the multi-channel includes channels respectively including electrical connections, the electrical connections connecting the first computing device with the second computing device, and reconstructing the message by aggregating the segments in the second computing device, wherein a bandwidth of the multi-channel transmitting the segments is greater than a maximum bandwidth of a single electrical connection of the electrical connections.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Wooseok Hwaseong-si, KR 21 30
Gara, Alan Palo Alto, US 72 2224
Hong, Young Jun Seoul, KR 144 1092
Lee, Wonseok Suwon-si, KR 85 1208
Lee, Wonyong Seoul, KR 13 6

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