Topside air cooling of electronic packages
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 28, 2025
Grant Date -
Nov 18, 2021
app pub date -
Jul 30, 2021
filing date -
Jul 30, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
The semiconductor chip includes a semiconductor substrate having a surface, a circuit formed on the surface, and a plurality of pillars coupled to the surface adjacent to the circuit. The plurality of pillars is thermally conductive and is thermally coupled to the circuit so as to dissipate heat generated by the circuit. The semiconductor substrate, circuit, and plurality of pillars are integral parts of the integrated semiconductor chip. A method of fabricating the integrated semiconductor chip includes providing a semiconductor substrate having a surface. The method includes forming a circuit on the surface, and forming a plurality of pillars thermally coupled to the surface adjacent to the circuit.
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