Single die design for different polarizations

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12212074
APP PUB NO 20220311137A1
SERIAL NO

17651832

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Abstract

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An integrated circuit comprising a package, phased antenna array and die. The die comprises a plurality of unit cells, wherein each unit cell is divided into quadrants. Each quadrant comprises a receiver terminal located on a first axis, and a transmitter terminal located on a second axis, wherein the first axis is orthogonal to the second axis, and there is mirror symmetry between the nearest neighbour quadrants in the unit cell. The package comprises a plurality of pairs of feed lines, each pair of feed lines comprising a receiver feed line and a transmitter feed line. The receiver feed line is connected to one of the receiver terminals and the transmitter feed line is connected to the transmitter terminal in the same die quadrant. The receiver feed line is orthogonal to the transmitter feed line. Each antenna element is coupled to a respective pair of feed lines.

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Patent Owner(s)

Patent OwnerAddress
NXP B V350 HOLGER WAY SAN JOSE CA 95134

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Acar, Mustafa Eindhoven, NL 39 162
Bergman, Jan Willem Veghel, NL 8 13
Kamphuis, Antonius Hendrikus Jozef Nijmegen, NL 26 33
Leenaerts, Dominicus Martinus WilHelmus Riethoven, NL 43 207
Mandamparambil, Rajesh Eindhoven, NL 10 19
Mattheijssen, Paul Boxtel, NL 18 47

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