Semiconductor devices and methods of manufacturing semiconductor devices

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12211762
APP PUB NO 20230078862A1
SERIAL NO

17473834

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Abstract

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In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.

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Patent Owner(s)

  • AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Dong Hee Gyenoggi-do, KR 12 162
Lee, Sang Hyoun Incheon, KR 10 11
Ma, Sang Yun Incheon, KR 5 4

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