Protector cap for package with thermal interface material

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12211761
APP PUB NO 20230395442A1
SERIAL NO

18235104

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method of manufacturing a package includes mounting an electronic component on an electrically conductive carrier, encapsulating part of the carrier and the electronic component by an encapsulant, covering an exposed surface portion of the carrier with an electrically insulating and thermally conductive interface structure, and covering at least part of the interface structure by a protection cap.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AUSTRIA AG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasztelan, Christian Penang, MY 15 85
Khoo, Nee Wan Melaka, MY 10 22

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