Simultaneous bonding approach for high quality wafer stacking

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12211727
APP PUB NO 20230238268A1
SERIAL NO

18191904

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In some embodiments, the present disclosure relates to a method that includes aligned a first wafer with a second wafer. The second wafer is spaced apart from the first wafer. The first wafer is arranged on a first electrostatic chuck (ESC). The first ESC has electrostatic contacts that are configured to attract the first wafer to the first ESC. Further, the second wafer is brought toward the first wafer to directly contact the first wafer at an inter-wafer interface. The inter-wafer interface is localized to a center of the first wafer. The second wafer is deformed to gradually expand the inter-wafer interface from the center of the first wafer toward an edge of the first wafer. The electrostatic contacts of the first ESC are turned OFF such that the first and second wafers are bonded to one another by the inter-wafer interface.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Xin-Hua Xihu Township, TW 73 1348
Liu, Ping-Yin Yonghe, TW 108 2161
Tsao, Chang-Chen Tainan, TW 9 11

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