Non-woven film for electronic components and fabricating method thereof

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12209357
APP PUB NO 20220178071A1
SERIAL NO

17540372

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Abstract

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A non-woven film for electronic components is provided in the present disclosure. The non-woven film for electronic components includes a polyetherimide substrate and an aerogel. The aerogel is disposed on the polyetherimide substrate. The aerogel has a moisture content between 0.7% and 0.9% and a porosity between 85% and 95%.

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Patent Owner(s)

  • TAIWAN TEXTILE RESEARCH INSTITUTE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Shao-Yen New Taipei, TW 8 0
Chou, Shang-Chih New Taipei, TW 16 3
Lin, Chun-Hung New Taipei, TW 314 2365

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