Liquid epoxy molding compound and preparation method thereof

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United States of America

PATENT NO 12209171
APP PUB NO 20240425669A1
SERIAL NO

18826534

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Abstract

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Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 μm-100 μm accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.

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Patent Owner(s)

Patent OwnerAddress
HUBEI CHOICE TECHNOLOGY CO LTDC3-1 OPTICS VALLEY UNITED TECHNOLOGY CITY GAOXIN THIRD ROAD GEDIAN DEVELOPMENT ZONE EZHOU 436070

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liao, Shuhang Ezhou, CN 15 1
Su, Junxing Ezhou, CN 15 1
Wang, Shengquan Ezhou, CN 19 60
Wu, De Ezhou, CN 19 20

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