Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board

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United States of America

PATENT NO 12209160
APP PUB NO 20220185945A1
SERIAL NO

17599274

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Abstract

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A resin composition contains an epoxy compound and a curing agent. The epoxy compound includes a phosphorus-containing epoxy compound having a phosphorus atom in its molecule. The curing agent includes a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in its molecule.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTDOSAKA-SHI OSAKA 540-6207

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nii, Daisuke Osaka, JP 16 64

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