MEMS packages and methods of manufacture thereof

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12209015
APP PUB NO 20230278857A1
SERIAL NO

18316391

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Abstract

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Microelectromechanical systems (MEMS) packages and methods of manufacture thereof are described. In an embodiment, a method of manufacturing a MEMS package may include attaching a MEMS structure having a capping structure thereon to a device wafer comprising a plurality of first devices formed therein to form a wafer level MEMS package; and singulating the device wafer having the MEMS structure attached thereto to form a plurality of chip scale MEMS packages.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yee, Kuo-Chung Taoyuan, TW 221 2787
Yu, Chen-Hua Hsinchu, TW 2207 47923

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