Wafer level package for device
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Jan 28, 2025
Grant Date -
Feb 16, 2023
app pub date -
Jan 25, 2021
filing date -
Jan 25, 2021
priority date (Note) -
In Force
status (Latency Note)
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Abstract
According to an example aspect of the present invention, there is provided a wafer level package for a device, the package comprising: a first substrate and a second substrate, a sealing structure comprising a seal ring and a bonding layer between the first substrate and the second substrate, and a lateral electrical connection line on a surface of the first substrate, which lateral electrical connection line extends through the seal ring for creating an electrical connection between the device inside the package and an electrical circuit outside the package.
First Claim
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International Classification(s)
- 2021 Application Filing Year
- B81C Class
- 283 Applications Filed
- 131 Patents Issued To-Date
- 46.29 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B81C Class
- 0 % this patent is cited more than
- < 1 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jul 28, 2028 |
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