Integrated circuit bond pad with multi-material toothed structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12205910
APP PUB NO 20230260938A1
SERIAL NO

18141621

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Abstract

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An integrated circuit device may include a multi-material toothed bond pad including (a) an array of vertically-extending teeth formed from a first material, e.g., aluminum, and (b) a fill material, e.g., silver, at least partially filling voids between the array of teeth. The teeth may be formed by depositing and etching aluminum or other suitable material, and the fill material may be deposited over the array of teeth and extending down into the voids between the teeth, and etched to expose top surfaces of the teeth. The array of teeth may collectively define an abrasive structure. The multi-material toothed bond pad may be bonded to another bond pad, e.g., using an ultrasonic or thermosonic bonding process, during which the abrasive teeth may abrade, break, or remove unwanted native oxide layers formed on the respective bond pad surfaces, to thereby create a direct and/or eutectic bonding between the bond pads.

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Patent Owner(s)

Patent OwnerAddress
MICROCHIP TECHNOLOGY INCORPORATED2355 WEST CHANDLER BLVD CHANDLER AS 85224-6199

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Bomy Newark, US 90 1658
Kovats, Julius Manitou Springs, US 9 1
Leng, Yaojian Portland, US 74 158
Marsico, Gerald Monument, US 2 1
Sato, Justin West Linn, US 22 28

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