Sensor packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12205860
APP PUB NO 20230352357A1
SERIAL NO

18351010

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Tsung-Hsien Hsinchu, TW 58 345
Huang, Yu-Chih Hsinchu, TW 93 475
Kuo, Ting-Ting Hsinchu, TW 34 114
Lai, Chi-Hui Taichung, TW 42 124
Liu, Chiahung Hsinchu, TW 15 41
Liu, Chung-Shi Hsinchu, TW 824 11367
Tai, Chih-Hsuan Taipei, TW 58 189
Tsai, Hao-Yi Hsinchu, TW 489 3426
Tseng, Ying-Cheng Tainan, TW 37 92
Wu, Ban-Li Hsinchu, TW 24 68
Yu, Chen-Hua Hsinchu, TW 2207 47923

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