Semiconductor processing chamber to accommodate parasitic plasma formation

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United States of America Patent

PATENT NO 12205845
APP PUB NO 20220130713A1
SERIAL NO

17078520

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Abstract

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Exemplary processing systems may include a chamber body. The systems may include a pedestal configured to support a semiconductor substrate. The systems may include a faceplate. The chamber body, the pedestal, and the faceplate may define a processing region. The faceplate may be coupled with an RF power source. The systems may include a remote plasma unit. The remote plasma unit may be coupled at electrical ground. The systems may include a discharge tube extending from the remote plasma unit towards the faceplate. The discharge tube may define a central aperture. The discharge tube may be electrically coupled with each of the faceplate and the remote plasma unit. The discharge tube may include ferrite extending about the central aperture of the discharge tube.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fischbach, Adam J Campbell, US 4 5
Kangude, Abhijit A Mountain View, US 11 5
Paul, Khokan Chandra Cupertino, US 12 17
Rocha-Alvarez, Juan Carlos San Carlos, US 226 10949
Tanaka, Tsutomu Santa Clara, US 399 11273

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