Method of training deep learning model for predicting pattern characteristics and method of manufacturing semiconductor device
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United States of America Patent
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Jan 21, 2025
Grant Date -
Apr 21, 2022
app pub date -
Apr 30, 2021
filing date -
Oct 16, 2020
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Abstract
A method of manufacturing a semiconductor device includes forming a pattern on a wafer, measuring a spectrum of the pattern on the wafer, with a spectral optical system, performing an analysis of the spectrum through a deep learning model for predicting pattern characteristics, the deep learning model being trained based on a domain knowledge, and evaluating the pattern on the wafer based on the analysis of the spectrum, wherein the domain knowledge includes a noise inducing factor of the spectral optical system.
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