Preparation method for ultrahigh-conductivity multilayer single-crystal laminated copper material, and copper material

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United States of America Patent

PATENT NO 12203193
APP PUB NO 20230080832A1
SERIAL NO

17798116

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Abstract

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Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.

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Patent Owner(s)

Patent OwnerAddress
PEKING UNIVERSITY100871 PEKING UNIVERSITY 5 THE SUMMER PALACE ROAD BEIJING HAIDIAN DISTRICT BEIJING CITY BEIJING CITY 100871

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Kaihui Beijing, CN 11 5
Wang, Enge Beijing, CN 5 0
Wu, Muhong Beijing, CN 2 0
Yu, Dapeng Beijing, CN 8 28

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