Copper alloy, copper alloy plastic working material, component for electronic/electrical device, terminal, bus bar, lead frame, and heat dissipation substrate

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United States of America

PATENT NO 12203158
APP PUB NO 20230250514A1
SERIAL NO

18003398

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Abstract

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This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio TLD/TTD is greater than 0.95 and less than 1.08. The half-softening temperature TLD is 210° C. or higher.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuoka, Kosei Kitamoto, JP 16 19
Funaki, Shinichi Aizuwakamatsu, JP 14 14
Maki, Kazunari Kitamoto, JP 74 205
Matsunaga, Hirotaka Kitamoto, JP 33 79
Mori, Hiroyuki Sakai, JP 401 3349
Morikawa, Kenji Aizuwakamatsu, JP 30 175

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