Panel molded electronic assemblies with integral terminals
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 14, 2025
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N/A
app pub date -
Mar 18, 2022
filing date -
Mar 18, 2022
priority date (Note) -
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Abstract
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.
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