Package device
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 14, 2025
Grant Date -
Jan 18, 2024
app pub date -
Sep 27, 2023
filing date -
Sep 27, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
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