Wiring base, package for storing semiconductor element, and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 14, 2025
Grant Date -
Jan 12, 2023
app pub date -
Nov 27, 2020
filing date -
Nov 27, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring base includes a base having a first surface, at least one metal layer positioned on the first surface, at least one lead terminal positioned on the metal layer, and a joining member that is positioned on the metal layer and joins the lead terminal to the metal layer. The lead terminal has a first portion to be in contact with the joining member and also has a second portion being continuous with the first portion. In a cross section of the lead terminal orthogonal to a longitudinal direction of the lead terminal, the first portion has two concave surfaces that are formed near the metal layer so as to be disposed opposite to each other across a center in a transverse direction of the lead terminal.
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