Method of direct-bonded optoelectronic devices

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12199082
APP PUB NO 20240063199A1
SERIAL NO

18498718

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Abstract

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Direct-bonded LED arrays and applications are provided. An example process fabricates a LED structure that includes coplanar electrical contacts for p-type and n-type semiconductors of the LED structure on a flat bonding interface surface of the LED structure. The coplanar electrical contacts of the flat bonding interface surface are direct-bonded to electrical contacts of a driver circuit for the LED structure. In a wafer-level process, micro-LED structures are fabricated on a first wafer, including coplanar electrical contacts for p-type and n-type semiconductors of the LED structures on the flat bonding interface surfaces of the wafer. At least the coplanar electrical contacts of the flat bonding interface are direct-bonded to electrical contacts of CMOS driver circuits on a second wafer. The process provides a transparent and flexible micro-LED array display, with each micro-LED structure having an illumination area approximately the size of a pixel or a smallest controllable element of an image represented on a high-resolution video display.

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Patent Owner(s)

Patent OwnerAddress
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC3025 ORCHARD PARKWAY SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katkar, Rajesh Milpitas, US 274 7233
Tao, Min San Jose, US 31 536
Uzoh, Cyprian Emeka San Jose, US 382 12692
Wang, Liang Milpitas, US 656 6142

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