Heterogeneous annealing method and device
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United States of America
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Jan 14, 2025
Grant Date -
Jun 29, 2023
app pub date -
Dec 28, 2022
filing date -
Dec 28, 2022
priority date (Note) -
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Abstract
A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating material. A portion of the first substrate is removed to leave a remaining portion. A third substrate having a coefficient of thermal expansion (CTE) substantially the same as a CTE of the first substrate is bonded to the remaining portion. The bonded substrates are heated to facilitate electrical contact between the first and second contact structures. The third substrate is removed after heating to provided a bonded structure with reliable electrical contacts.
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