Sintering a nanoparticle paste for semiconductor chip join

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12199059
APP PUB NO 20220262754A1
SERIAL NO

17178410

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Abstract

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An approach to provide a method of joining a semiconductor chip to a semiconductor substrate, the approach includes depositing a nanoparticle paste and aligning each of one or more solder contacts on a semiconductor chip to a substrate bond pad. The approach includes sintering, in a reducing gaseous environment, the nanoparticle paste to connect the semiconductor chip to a semiconductor substrate bond pad.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farooq, Mukta Ghate Hopewell Jct, US 55 123
Sakuma, Katsuyuki Fishkill, US 96 367

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