Method and apparatus for improved wafer coating

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12199054
APP PUB NO 20220367390A1
SERIAL NO

17574484

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Abstract

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A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Cheng-Feng Hsinchu, TW 9 217
Yu, Chih-Jen Hsinchu, TW 5 6

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