Radio-frequency module and communication device
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 14, 2025
Grant Date -
Mar 31, 2022
app pub date -
Dec 14, 2021
filing date -
Dec 14, 2021
priority date (Note) -
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Abstract
To reduce the height in a thickness direction of a mounting substrate. A radio-frequency module includes a mounting substrate, an electronic component, first and second chip components. The electronic component is mounted on a first main surface of the mounting substrate. The first and second chip components are mounted on a second main surface of the mounting substrate. Each of the first and second chip components includes a substrate and a circuit portion. The substrate has first and second main surfaces facing each other. The circuit portion is formed on the first main surface side of the substrate. The second main surface of the substrate in each of the first and second chip components is exposed. A material of the substrate in the first chip component is the same as a material of the substrate in the second chip component.
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