Modular microchannel thermal solutions for integrated circuit devices
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United States of America
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Jan 14, 2025
Grant Date -
Dec 30, 2021
app pub date -
Jun 26, 2020
filing date -
Jun 26, 2020
priority date (Note) -
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Abstract
A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port. A second material is within a portion of the channel. The second material supplements the first material to modify the initial fluid path into a final fluid path between the fluid inlet port and the fluid outlet port. The second material may have a different composition and/or microstructure than the first material.
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