Member for semiconductor manufacturing apparatus, method for manufacturing the same, and mold
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Jan 14, 2025
Grant Date -
Oct 1, 2020
app pub date -
Mar 18, 2020
filing date -
Mar 18, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A member for a semiconductor manufacturing apparatus includes a ceramic disc incorporating an electrode and a ceramic cylindrical shaft supporting the disc. The disc and the shaft are integrally formed and mutually have no bonding interface. The disc has a surface with which the shaft is integrated. The surface has a region inside the shaft and a region outside the shaft. The region inside the shaft is recessed by one step with respect to the region outside the shaft and has an electrode exposure hole through which the electrode is exposed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully