Substrate handling in a modular polishing system with single substrate cleaning chambers

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12198944
APP PUB NO 20220143780A1
SERIAL NO

17202245

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Abstract

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Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems, and more particular, to modular polishing systems used in the manufacturing of semiconductor devices. In one embodiment, a polishing system includes a first portion having a plurality of polishing stations disposed therein, and a second portion coupled to the first portion, the second portion comprising a substrate cleaning system. The substrate cleaning system comprises a wet-in/dry-out substrate cleaning module comprising a chamber housing which defines a chamber volume. The polishing system further includes a substrate handler located in the second portion, where the substrate handler is positioned to transfer substrates to or from the wet-in/dry-out substrate cleaning module through one or more openings formed in one or more sidewalls of the chamber housing.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Brian J Palo Alto, US 204 5717
Ji, Jin Santa Clara, US 23 428
Mikhaylichenko, Ekaterina San Jose, US 16 25
Rangarajan, Jagan San Jose, US 38 103
Zuniga, Steven M Soquel, US 206 2730

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