Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Jan 14, 2025
Grant Date -
Oct 6, 2022
app pub date -
Feb 17, 2022
filing date -
Feb 17, 2022
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A negative photosensitive resin composition including: an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof, a polymer compound having a structural unit formed by cyclopolymerization, a compound that generates an acid by light, and a heat crosslinking agent.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully