Motorized chuck stage controlling method
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United States of America
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Jan 14, 2025
Grant Date -
Oct 5, 2023
app pub date -
Mar 14, 2023
filing date -
Mar 14, 2023
priority date (Note) -
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Abstract
A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.
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