Heat dissipation structure, manufacturing method therefor, and vacuum valve
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United States of America
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Jan 14, 2025
Grant Date -
Dec 29, 2022
app pub date -
Apr 13, 2020
filing date -
Apr 13, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
In a vacuum valve, as a heat dissipation structure thereof, a heat dissipation layer is provided to a part of the surface of each of a fixed conductor and a movable conductor which are a heat generation part, and a radiation heat absorption layer is provided to an insulation cylinder so as to be opposed to the heat dissipation layer. The heat dissipation layer and the radiation heat absorption layer are each formed from a ceramic having a high emissivity. Heat generated at the fixed conductor and the movable conductor is radiated by the heat dissipation layer, to be absorbed by the radiation heat absorption layer, and then radiated to the outside of the vacuum valve from the radiation heat absorption layer and a ceramic layer.
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