Fabrication of MEMS device with automated dispensing of damping fluid and viscosity control
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Jan 14, 2025
Grant Date -
May 30, 2024
app pub date -
Feb 8, 2024
filing date -
Feb 8, 2024
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.
First Claim
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International Classification(s)
- 2024 Application Filing Year
- H02N Class
- 126 Applications Filed
- 4 Patents Issued To-Date
- 3.18 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H02N Class
- 0 % this patent is cited more than
- < 1 Age
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