Electronics housing and assembly method
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 7, 2025
Grant Date -
Jun 22, 2023
app pub date -
Mar 29, 2021
filing date -
Mar 29, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
An electronics housing (10) including a circuit board (3) that is through-plated via press-fit connections (5), and including guide pins (6, 7) extending through circuit board through-holes (8, 9) provided in the circuit board (3). In order to simplify the assembly of the electronics housing (10), the guide pins (6, 7) protrude from a first press-fit body (4) of at least one first press-fit connection (5), and a second press-fit body of at least one second press-fit connection is guided onto the guide pins (6, 7) of the first press-fit body (4) on a side of the circuit board (3) facing away from the first press-fit body (4).
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