Composite integrated film, composite integrated film supply wafer, and semiconductor composite device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12191292
APP PUB NO 20220157796A1
SERIAL NO

17504306

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Abstract

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A composite integrated film includes a base member thin film having a base member first surface and a base member second surface facing each other, one or more penetration parts penetrating the base member first surface and the base member second surface of the base member thin film, one or more electrodes each including an electrical path part formed between the base member first surface and the base member second surface via the penetration part and an electrode surface in a planar shape formed on the base member second surface's side, and one or more elements provided on the base member first surface of the base member thin film and electrically connected to the electrodes, wherein the electrode surface and the base member second surface form a same flat surface.

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Patent Owner(s)

Patent OwnerAddress
OKI ELECTRIC INDUSTRY CO LTDTOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furuta, Hironori Tokyo, JP 32 61
Ishikawa, Takuma Tokyo, JP 53 390
Jyumonji, Shinya Tokyo, JP 8 4
Kawada, Hiroto Tokyo, JP 17 0
Kosaka, Toru Tokyo, JP 55 320
Matsuo, Genichiro Tokyo, JP 6 8
Nakai, Yusuke Tokyo, JP 51 146
Shinohara, Yuuki Tokyo, JP 22 10
Suzuki, Takahito Tokyo, JP 83 964
Takahashi, Chihiro Tokyo, JP 25 120
Tanigawa, Kenichi Tokyo, JP 29 132

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