Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12191284
APP PUB NO 20230378137A1
SERIAL NO

18231192

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Abstract

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A semiconductor device assembly comprises a substrate including internal contacts on a first side and first external contacts on a second side. The assembly further comprises one or more first dies disposed over the first side and electrically coupled to the internal contacts, and a interposer having a length and a width less than a length and a width of the substrate, having inner contacts on a first side, and having second external contacts on a second side. The interposer is coupled to the second side of the substrate by one or more of the inner contacts. The assembly further comprises a second die disposed between the substrate and the interposer. The assembly further comprises first solder balls on the first external contacts, and second solder balls on the second external contacts. The first and second solder balls are configured to bond with co-planar package contacts.

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Patent Owner(s)

  • MICRON TECHNOLOGY INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Monadgemi, Pezhman Santa Clara, US 44 1134

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