Heater and heating base
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 7, 2025
Grant Date -
Jul 13, 2023
app pub date -
Feb 24, 2023
filing date -
Feb 24, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure provides a heater and a heating base. The heater is used in a semiconductor process apparatus and includes a heating body and a base configured to support the heating body. The base includes a base body and a plate connected to each other. The base body is opposite to the heating body and arranged at an interval. The plate is arranged between the base body and the heating body and is fixedly connected to the heating body. An elastic bending structure is arranged on at least one of the plate, the base body, or the connection place between the plate and the base body. The elastic bending structure is configured to cause the plate and the heating body to remain connected by generating elastic deformation when the plate and the base body expand and deform.
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