Customized smart devices and touchscreen devices and cleanspace manufacturing methods to make them
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United States of America
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Jan 7, 2025
Grant Date -
Feb 16, 2023
app pub date -
Sep 12, 2022
filing date -
Sep 12, 2022
priority date (Note) -
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Abstract
The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices and multi-chip modules such as chiplets. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.
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