Polishing pad, method for manufacturing polishing pad, and polishing method
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United States of America
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Jan 7, 2025
Grant Date -
Jul 21, 2022
app pub date -
Jun 4, 2020
filing date -
Jun 4, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a polishing pad including a polishing layer having a polishing surface, wherein the polishing surface includes a deep-groove region having a first pattern formed by a deep groove or hole having a depth of 0.3 mm or more, and a land region that is a region other than the deep-groove region, and the land region includes shallow recesses having a second pattern and a depth of 0.01 to 0.1 mm, and a plurality of island-like land portions surrounded by the shallow recesses and having a maximum distance in a horizontal direction of 8 mm or less.
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