Graphene thermally conductive gasket edge-wrapped process and edge-wrapped graphene thermally conductive gasket

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United States of America

PATENT NO 12185500
APP PUB NO 20230078935A1
SERIAL NO

17580635

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Abstract

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The present application relates to the field of electronic product heat dissipation component and in particular, relates to a graphene thermally conductive gasket edge-wrapped process and an edge-wrapped graphene thermally conductive gasket. The process steps are: coating a layer of adhesive on the first layer of graphene film, placing the second layer of graphene film on the first layer of graphene film, repeating stacking to the target height, obtaining a graphene film block, punching a plurality of through holes penetrating two surfaces of the graphene film block; threading the carbon fiber through the through holes after coating an adhesive on the surface thereof; slicing along the direction parallel to the thickness direction of the graphene film, to obtain the graphene thermally conductive gasket with a specified thickness; and coating a layer of glue on the peripheral sides of the graphene thermally conductive gasket to form an edge-wrapped layer.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN HFC CO LTDFIRST/SECOND/THIRD FLOOR C BUILDING NO 7 FUYONG EAST AVENUE FENGHUANG COMMUNITY FUYONG STREET BAO'AN DISTRICT SHENZHEN GUANGDONG 518103 518103

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cao, Yong Guangdong, CN 148 2023
Dou, Lanyue Guangdong, CN 2 0
He, Xichang Guangdong, CN 1 0
Sun, Aixiang Guangdong, CN 1 0
Yang, Shangqiang Guangdong, CN 1 0
Zhou, Xiaoyan Guangdong, CN 23 96

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