Semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America
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Dec 31, 2024
Grant Date -
Jul 28, 2022
app pub date -
Apr 19, 2022
filing date -
Apr 19, 2022
priority date (Note) -
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Abstract
A semiconductor device has: a first chip having a substrate and a first wiring layer; and a second wiring layer formed on a second surface of the substrate. The second wiring layer has a first power supply line, and a second power supply line. The first chip has a first ground line, a third power supply line, a fourth power supply line, vias formed in the substrate and connecting the first power supply line and the third power supply line, a first area in which the first ground line and the fourth power supply line are arranged, and a first circuit connected between the first ground line and the third power supply line. A switch is connected between the first power supply line and the second power supply line. In a plan view, the third power supply line, the vias, and the first circuit are arranged in the first area.
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