Electronic package structure

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12184266
APP PUB NO 20230208394A1
SERIAL NO

18112464

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Ching-Han Kaohsiung, TW 28 72
Lai, Kuo-Hua Kaohsiung, TW 11 80
Lai, Lu-Ming Kaohsiung, TW 68 134
Liu, Hui-Chung Kaohsiung, TW 11 10
Tseng, Chi Sheng Kaohsiung, TW 17 32

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