Resonator package and method of manufacturing the same

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United States of America

PATENT NO 12184265
APP PUB NO 20190199319A1
SERIAL NO

16292715

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Abstract

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A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDYEONGTONG-GU SUWON GYUNGGI-DO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Duck Hwan Suwon-si, KR 65 478
Kim, Tae Yoon Suwon-si, KR 125 709
Lee, Jae Chang Suwon-si, KR 43 195
Lee, Moon Chul Suwon-si, KR 93 540
Lee, Yeong Gyu Suwon-si, KR 33 157

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