Surface-mount amplifier devices

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12184237
APP PUB NO 20230133034A1
SERIAL NO

17516360

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Abstract

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A device includes a package body including a central flange and an amplifier module mounted to the central flange of the surface-mount device. The amplifier module includes a module substrate mounted to the central flange. The module substrate includes a first die mount window, a first circuitry on a first surface of the module substrate, a second circuitry on the first surface of the module substrate, and a first amplifier die mounted on the central flange. The first amplifier die is at least partially disposed within the first die mount window and the first amplifier die is electrically connected to the first circuitry and the second circuitry. The first circuitry is electrically connected to a first lead of the package body and the second circuitry is electrically connected to a second lead of the package body.

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Patent Owner(s)

Patent OwnerAddress
NXP USA INC6501 WILLIAM CANNON DRIVE AUSTIN TX 78735

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gong, Zhiwei Chandler, US 70 737
Ll, Li Scottsdale, US 12 80
Ll, Lu Gilbert, US 2 6
Maalouf, Elie A Mesa, US 31 174
Pabst, Eduard Jan Mesa, US 6 7
Santos, Fernando A Chandler, US 33 190
Viswanathan, Lakshminarayan Phoenix, US 95 679

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