Separable interface cable structure for high voltage under-module power input
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United States of America
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Dec 31, 2024
Grant Date -
Jun 22, 2023
app pub date -
Dec 17, 2021
filing date -
Dec 17, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.
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