Semiconductor device with enhanced thermal dissipation and method for making the same

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United States of America

PATENT NO 12183655
APP PUB NO 20220367318A1
SERIAL NO

17874274

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Abstract

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A method includes forming a solder layer on a surface of one or more chips. A lid is positioned over the solder layer on each of the one or more chips. Heat and pressure are applied to melt the solder layer and attach each lid to a corresponding solder layer. The solder layer has a thermal conductivity of ≥50 W/mK.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yang-Che Hsinchu, TW 39 114
Liang, Victor Chiang Hsinchu, TW 108 292
Lin, Chen-Hua Douliu, TW 54 292
Liu, Chwen-Ming Hsinchu, TW 39 374
Tseng, Huang-Wen Zhubei, TW 33 116

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