Packaging of a semiconductor device with dual sealing materials

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12183647
APP PUB NO 20210193546A1
SERIAL NO

17196317

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a semiconductor device including an insulating layer, a conductive layer bonded to one main surface of the insulating layer, a semiconductor element arranged such that the upper surface of the semiconductor element faces a direction same as the one main surface of the insulating layer, an upper electrode provided on the upper surface of the semiconductor element, a wiring member that has one end electrically bonded to the upper electrode of the semiconductor element and has another end electrically bonded to the conductive layer, and has a hollow portion, a first sealing material, and a second sealing material, in which the first sealing material seals at least part of the semiconductor element so as to be in contact with the semiconductor element, and the second sealing material seals the wiring member so as to be in contact with the wiring member.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONTOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujino, Junji Tokyo, JP 54 443
Kawashima, Hiroshi Tokyo, JP 180 1962
Maeda, Taketoshi Hiroshima, JP 3 7
Sakamoto, Soichi Tokyo, JP 6 52

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